item | ||||||
mass production | trial run | |||||
layers | 32 | 42 | ||||
min line / space | 40/40μm (1.6/1.6mil) | 35/35μm (1.4/1.4mil) | ||||
min. laser drill diameter | 70μm (2.8mil) | 65μm (2.6mil) | ||||
aspect ratio of pth | 16:1 | 18:1 | ||||
min .core thickness(excluding copper) | 40μm(1.6mil) | 30μm(1.2mil) | ||||
anylayer interconnection | 6 2 6 | 7 2 7 | ||||
material | fr4, megtron, rogers, heavy copper, etc. | |||||
surface finish | lead-free hasl, enig, osp, immersion silver, immersion tin, flash gold, gold finger plating, selective hard gold plating, enpig, pdni plating | |||||
技术能力
