item | 2017 | 2018~2019 | 2020~2021 | |||
mass production | try run | mass production | try run | mass production | try run | |
layers | 32 | 42 | 38 | 44 | 42 | 48 |
min line (µm) | 40 | 35 | 35 | 30 | 35 | 30 |
min. drill hole diameter ( mm ) | 0.15 | 0.10 | 0.15 | 0.10 | 0.15 | 0.10 |
aspect ratio of pth | 16:1 | 18:1 | 18:1 | 20:1 | 18:1 | 20:1 |
n+c+n | 5+c+5 | 6+c+6 | 5+c+5 | 6+c+6 | 5+c+5 | 6+c+6 |
any layer interconnection | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 |
plate filling via | yes | --- | yes | --- | yes | --- |
min. core thickness | 50 | 40 | 40 | 30 | 40 | 30 |
pth hole size | ±50 | --- | ±50 | --- | ±50 | --- |
min. laser drill diameter (um) | 65 | 50 | 50 | 40 | 50 | 40 |
embedded capacitor | yes | --- | yes | --- | yes | --- |
material | fr4, megtron, nelco, rogers, heavy copper, etc. | |||||
surface process | lead-free hasl, enig, osp, immersion silver, immersion tin, flash gold, gold | |||||
technology roadmap
